Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 11, 2008
Patent Application Number
11200077
Date Filed
August 10, 2005
Patent Primary Examiner
Patent abstract
A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.
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