Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
You Yang Ong0
Garrett L. Wong0
Kwang Yong Chung0
Mohd Helmy Bin Ahmad0
Christoph B. Luechinger0
Date of Patent
October 28, 2008
0Patent Application Number
111640870
Date Filed
November 9, 2005
0Patent Primary Examiner
Patent abstract
An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
