US Patent 7443014 Electronic module and method of assembling the same

Patent 7443014 was granted and assigned to Infineon Technologies on October, 2008 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Infineon Technologies

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7443014

Date of Patent

October 28, 2008

Patent Application Number

11257403

Date Filed

October 25, 2005

Patent Primary Examiner

‌

Trung Dang

Patent abstract

An electronic module includes a semiconductor power switch and a semiconductor diode. The lower side of the semiconductor power switch includes an output contact mounted on a die pad of a leadframe, and the upper side of the semiconductor power switch includes a control contact and an input contact. The anode contact of the semiconductor diode is disposed on and electrically connected to the input contact of the semiconductor power switch. The cathode contact of the diode is electrically connected with the output contact of the power semiconductor switch.