Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 21, 2008
Patent Application Number
09789397
Date Filed
February 21, 2001
Patent Citations Received
Patent Primary Examiner
Patent abstract
An encapsulated semiconductor device and method wherein an encapsulant material is deposited on the device in an environment that enhances device performance. Illustrative encapsulant materials are organic polymers, silicon polymers and metal/polymer-layered encapsulants. Encapsulant formation environments may include inert, reducing and ammonia gas environment. Further disclosed are an encapsulated transistor and a semiconductor device.
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