Patent attributes
Herein disclosed are a component of a film-forming device, in which a thin films is formed on a substrate using a film-forming material, whose surface structure makes any breakage, peeling off and/or falling off of a film adhered to the component quite difficult, while the structure permits easy removal of such an adhered film within a short period of time when cleaning the component as sell as a method for cleaning the component. A large number of through holes each extending from the back face to the top face of the component are formed for the penetration of a cleaning solution into the boundary between the component and a film of the film-forming material adhered to the surface of the component and formed during the formation of the foregoing thin film. This easily allows the peeling off and removal of the film adhered to the component within a short period of time as compared when the adhered film is dissolved only from the surface thereof.
