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US Patent 7432572 Method for stripping sacrificial layer in MEMS assembly

Patent 7432572 was granted and assigned to Texas Instruments on October, 2008 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Texas Instruments
Texas Instruments
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7432572
Patent Inventor Names
Joshua Malone1
Date of Patent
October 7, 2008
Patent Application Number
11229968
Date Filed
September 19, 2005
Patent Primary Examiner
‌
Thao P. Le
Patent abstract

The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.

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