US Patent 7432572 Method for stripping sacrificial layer in MEMS assembly

Patent 7432572 was granted and assigned to Texas Instruments on October, 2008 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Texas Instruments

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7432572

Patent Inventor Names

Joshua Malone0

Date of Patent

October 7, 2008

Patent Application Number

11229968

Date Filed

September 19, 2005

Patent Primary Examiner

‌

Thao P. Le

Patent abstract

The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.