US Patent 7430870 Localized microelectronic cooling
Patent 7430870 was granted and assigned to Intel on October, 2008 by the United States Patent and Trademark Office.
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Patent abstract
An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling system comprising one or more thermoelectric cooler(s) is thermally coupled to a heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device.
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US Patent 07430870 Localized microelectronic cooling US Patent 7430870 Localized microelectronic cooling
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Patent Number
0743087000
Patent Number
743087000
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074308700
Date of Patent
October 7, 2008
0Patent Application Number
111743130
Date Filed
June 30, 2005
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074308700
Date of Patent
October 7, 2008
0Patent Application Number
111743130
Date Filed
June 30, 2005
0Official Website
Patent Primary Examiner
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US Patent 07430870 Localized microelectronic cooling
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07430870
Date of patent
October 7, 2008
Patent application number
11174313
Date Filed
June 30, 2005
Patent primary examiner
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