US Patent 7429868 Socket assembly for testing semiconductor device
Patent 7429868 was granted and assigned to Mirae on September, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 4, 2005
Date of Patent
September 30, 2008
Patent Application Number
11196238
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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