Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 16, 2008
Patent Application Number
11679730
Date Filed
February 27, 2007
Patent Primary Examiner
Patent abstract
A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.
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