Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 19, 2008
Patent Application Number
11637633
Date Filed
December 12, 2006
Patent Primary Examiner
Patent abstract
A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
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