A plurality of gate driver boards are bonded to a first side of a TFT substrate, and a wiring board made of a flexible printed wiring board is bonded between the gate driver boards. Then, a wiring disposed on the wiring board provides connection between adjacent gate driver boards. In the same manner, a plurality of data driver boards are bonded to a second side of the TFT substrate, and a wiring board made of a flexible printed wiring board is bonded between the data driver boards. Then, a wiring disposed on the wiring board provides connection between adjacent data driver boards.