Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tae-Duk Nam0
Sang-Hyeop Lee0
Se-Yong Oh0
Sung-Hwan Yoon0
Chan-Suk Lee0
Jin-Ho Kim0
Min-Keun Kwak0
Date of Patent
August 19, 2008
0Patent Application Number
110786400
Date Filed
March 11, 2005
0Patent Primary Examiner
Patent abstract
The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
