Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 5, 2008
Patent Application Number
10993587
Date Filed
November 19, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention improves a method of forming a surface unevenness using a difference in etching rates, and relaxes limitations on substrates in this method. In a method of the present invention, an uneven surface is formed by a method including applying pressure to a predetermined region in a surface of a thin film formed on a substrate, and etching a region including at least a portion of the predetermined region and at least a portion of the reminder of the surface that excludes the predetermined region. An etching rate difference within the thin film increases freedom in selecting a substrate material.
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