Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sa Yoon Kang0
Young Shin Kwon0
Min Kyo Cho0
Young Hoon Ro0
Date of Patent
July 29, 2008
0Patent Application Number
103471840
Date Filed
January 21, 2003
0Patent Citations Received
0
Patent Primary Examiner
Patent abstract
An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.
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