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US Patent 7402210 Apparatus and method for hybrid chemical processing

Patent 7402210 was granted and assigned to Applied Materials on July, 2008 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Current Assignee
Applied Materials
Applied Materials
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
74022101
Patent Inventor Names
Vincent W. Ku1
Dien-Yeh Wu1
Hua Chung1
Ling Chen1
Mei Chang1
Date of Patent
July 22, 2008
1
Patent Application Number
116809951
Date Filed
March 1, 2007
1
Patent Citations Received
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US Patent 11959172 Substrate processing systems including gas delivery system with reduced dead legs
2
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US Patent 11661654 Substrate processing systems including gas delivery system with reduced dead legs
3
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US Patent 11830731 Semiconductor deposition reactor manifolds
4
Patent Primary Examiner
‌
Rudy Zervigon
1
Patent abstract

In one embodiment, an apparatus for performing an atomic layer deposition process is provided which includes a chamber body having a substrate support, a lid assembly attached to the chamber body, and delivery sub-assemblies coupled to the lid assembly and configured to deliver process gases into a centralized expanding conduit, which extends through the lid assembly and expands radially outward. The first gas delivery sub-assembly contains an annular mixing channel encircling and in fluid communication with the centralized expanding conduit, wherein the annular mixing channel is adapted to deliver a first process gas through a plurality of passageways and nozzles and into the centralized expanding conduit. A first gas inlet may be coupled to the annular mixing channel and positioned to provide the first process gas to the annular mixing channel. The second gas delivery sub-assembly contains a second gas inlet in fluid communication to the centralized expanding conduit.

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