Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 1, 2008
Patent Application Number
10982455
Date Filed
November 4, 2004
Patent Primary Examiner
Patent abstract
An interconnect structure and its method for fabrication each employ an interconnect formed over and adjacent an active region of a semiconductor substrate. A gate electrode is also formed over the active region. Spacer layers are formed adjoining the interconnect and the gate electrode. A spacer layer adjoining the interconnect is removed and a bridging silicide conductor layer is formed bridging a top surface and a sidewall surface of the interconnect with a surface of the active region.
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