Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Feng-Ku Wang0
Chih-Kai Yang0
Date of Patent
June 17, 2008
0Patent Application Number
113994530
Date Filed
April 7, 2006
0Patent Primary Examiner
Patent abstract
A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing piece, wherein the fixing piece is fixed onto the internal side of the top plate of the support part, pressing against the heat plate, such that the heat plate and the heating element are tightly attached to each other, thereby achieving good heat conductive integration.
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