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US Patent 7381784 Epoxy group-containing silicon compound and thermosetting resin composition

Patent 7381784 was granted and assigned to Nippon Kayaku on June, 2008 by the United States Patent and Trademark Office.

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Current Assignee
Nippon Kayaku
Nippon Kayaku
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7381784
Patent Inventor Names
Koji Nakayama0
Date of Patent
June 3, 2008
Patent Application Number
10542718
Date Filed
February 10, 2004
Patent Primary Examiner
‌
Marc S. Zimmer
Patent abstract

The present invention relates to an epoxy group-containing silicon compound which is obtained by condensing at least one epoxy group-containing alkoxy silicon compound per se represented by the general formula (1a): R1aSi(OR2)3, wherein R1a denotes a substituent having an epoxy group and R2 denotes an alkyl group having at most 4 carbons, or said compound and at least one substituted alkoxy silicon compound represented by the general formula (1b): R1bSi(OR3)3, wherein R1b denotes an alkyl group having at most 10 carbons, an aryl group or an unsaturated aliphatic residue and R3 denotes an alkyl group having at most 4 carbons, in the presence of a basic catalyst.

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