US Patent 7378734 Stacked contact bump
Patent 7378734 was granted and assigned to Touchdown Technologies on May, 2008 by the United States Patent and Trademark Office.
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Patent abstract
A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.
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US Patent 07378734 Stacked contact bump US Patent 7378734 Stacked contact bump
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Patent Number
0737873400
Patent Number
737873400
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073787340
Date of Patent
May 27, 2008
0Patent Application Number
114210640
Date Filed
May 30, 2006
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073787340
Date of Patent
May 27, 2008
0Patent Application Number
114210640
Date Filed
May 30, 2006
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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US Patent 07378734 Stacked contact bump
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07378734
Date of patent
May 27, 2008
Patent application number
11421064
Date Filed
May 30, 2006
Patent primary examiner
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