Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hee-seok Lee0
Kyung-lae Jang0
Date of Patent
May 13, 2008
0Patent Application Number
111087940
Date Filed
April 19, 2005
0Patent Primary Examiner
Patent abstract
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bonding pads. The semiconductor chip and the electrical connections on the substrate may be encapsulated, and a board attached to a portion of a surface of the substrate may not be encapsulated.
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