US Patent 7368822 Copper metalized ohmic contact electrode of compound device

Patent 7368822 was granted and assigned to National Chiao Tung University on May, 2008 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

National Chiao Tung University

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7368822

Date of Patent

May 6, 2008

Patent Application Number

11377302

Date Filed

March 17, 2006

Patent Primary Examiner

‌

Eugene Lee

Patent abstract

The present invention provides an ohmic contact for a copper metallization whose heat diffusion is improved and cost is reduced. Therein, the ohmic contact is formed through a depositing and an annealing of three metal layers of Pd, Ge and Cu; and, the contact resistance of the ohmic contact is adjusted by the thicknesses of the three layers.