US Patent 7365414 Component packaging apparatus, systems, and methods

Patent 7365414 was granted and assigned to Intel on April, 2008 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7365414

Patent Inventor Names

James C Matayabas, Jr.0

Paul A. Koning0

Date of Patent

April 29, 2008

Patent Application Number

10750459

Date Filed

December 31, 2003

Patent Primary Examiner

‌

Quoc Hoang

Patent abstract

Dielectric materials comprising release agents are described. Also described are a process for improving the proccessability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.