Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chung Hoon Lee0
Do Hyung Kim0
Keon Young Lee0
Date of Patent
April 22, 2008
0Patent Application Number
111781440
Date Filed
July 8, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.
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