Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 22, 2008
Patent Application Number
10685550
Date Filed
October 14, 2003
Patent Primary Examiner
Patent abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
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