US Patent 7357165 Method and apparatus for cutting protective tape

Patent 7357165 was granted and assigned to Nitto Denko on April, 2008 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

73571650

Patent Inventor Names

Masayuki Yamamoto0

Date of Patent

April 15, 2008

Patent Application Number

109471700

Date Filed

September 23, 2004

Patent Primary Examiner

‌

Mark A Osele

Patent abstract

The present invention provides a method of moving a cutter blade along a circumferential edge of a semiconductor wafer, thereby cutting a protective tape joined to a surface of the semiconductor wafer with a pattern formed thereon for protecting the pattern before the semiconductor is processed. The cutter blade moves in the state where a side face thereof is brought into contact with the circumferential edge of the semiconductor wafer, thereby cutting the protective tape joined to the surface of the semiconductor wafer.