Patent attributes
A method is provided for modifying an electrical connector that is attached to a printed circuit board. On a wafer module of the electrical connector, a covering material is removed from an attachment area that is located above a signal pathway, and there is removed a connector pin that is connected to the signal pathway. A first end of a wire is attached to the attachment area of the wafer module to electrically connect to the signal pathway. The wire is run through a corresponding through-hole on the printed circuit board and the wafer module is inserted into an empty slot on the electrical connector. A second end of the wire is electrically connected to the printed circuit board or another wafer module. Also provided is an electronic assembly having a wire having a first end attached to a signal pathway of a wafer module of an electrical connector and a second end connected to a printed circuit board or another wafer module.
