Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsueh-Chung Chen0
Shin-Puu Jeng0
Hsien-Wei Chen0
Date of Patent
March 25, 2008
0Patent Application Number
111753290
Date Filed
July 7, 2005
0Patent Primary Examiner
Patent abstract
An interconnect architecture with improved reliability. An interconnect with rounded top corners is inlaid in a dielectric layer. A filler borders the interconnect along the corners of the interconnect.
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