Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 25, 2008
Patent Application Number
11283214
Date Filed
November 18, 2005
Patent Primary Examiner
Patent abstract
The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
