US Patent 7347952 Method of fabricating an ink jet printhead

An ink jet printhead chip includes a wafer substrate. A CMOS drive circuitry layer is positioned on the wafer substrate. A plurality of nozzle arrangements is positioned on the wafer substrate and the CMOS drive circuitry layer. Each nozzle arrangement includes nozzle chamber walls and a roof wall that define a nozzle chamber and an ink ejection port defined in the roof wall. A micro-electromechanical actuator is connected to the CMOS drive circuitry layer. The actuator has at least one movable member that is positioned to act on ink in the nozzle chamber to eject the ink from the ink ejection port on receipt of a signal from the drive circuitry layer. The movable member is spaced between 2 microns and 15 microns from the CMOS drive circuitry layer.