US Patent 7344971 Manufacturing method of semiconductor device

Patent 7344971 was granted and assigned to Seiko Epson on March, 2008 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Seiko Epson

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7344971

Date of Patent

March 18, 2008

Patent Application Number

11136309

Date Filed

May 24, 2005

Patent Primary Examiner

‌

Asok Kumar Sarkar

Patent abstract

A manufacturing method of a semiconductor device comprises: (a) setting up a paste including a resin on an electrical connection part which is electrically connected to a semiconductor substrate; (b) setting up a soldering material above the electrical connection part so as to be in contact with the paste; and (c) forming an external terminal from the soldering material and forming a reinforcement from the paste by fusing the soldering material and the paste. The reinforcement exposes part of the external terminal and covers a periphery of an edge of a base connected to the electrical connection part of the external terminal.