Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Peng Soon Lim0
Santhiran S/O Nadarajah0
Eng Hwa Tan0
Date of Patent
March 11, 2008
0Patent Application Number
108315370
Date Filed
April 22, 2004
0Patent Primary Examiner
Patent abstract
In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to expose a portion of the leads. The device areas can then be singulated by sawing, as in conventional QFN packages. In this manner, packages conforming to power package standards such as the TO 220 standard can be produced much quicker and cheaper than they can in conventional trim and forming methods.
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