Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 11, 2008
Patent Application Number
10521195
Date Filed
April 15, 2004
Patent Primary Examiner
Patent abstract
A semiconductor device characterized in that connection pads for wire bonding are arranged at peripheral regions of an electrode terminal formation surface of a semiconductor chip, test pads for testing the semiconductor chip are arranged in an inside region surrounded by said peripheral regions of said electrode terminal formation surface, and a plurality of rewiring patterns extend from the peripheral regions to said inside region of said electrode terminal formation surface and the individual rewiring patterns connect the individual electrode terminals and the corresponding connection pads and test pads.
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