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US Patent 7339256 Semiconductor device
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Patent
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Date Filed
October 28, 2004
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Date of Patent
March 4, 2008
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Patent Application Number
10974922
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Patent Citations Received
US Patent 11990428 Bonding structures in semiconductor packaged device and method of forming same
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US Patent 11862512 Semiconductor package and method of fabricating semiconductor package
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Patent Inventor Names
Masahiko Hasunuma
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Naofumi Nakamura
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Noriaki Matsunaga
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Sachiyo Ito
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Takeshi Nishioka
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
7339256
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Patent Primary Examiner
Edward Wojciechowicz
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