Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 26, 2008
Patent Application Number
10541158
Date Filed
December 22, 2003
Patent Primary Examiner
Patent abstract
In a protective tape applying and separating method according to this invention, a protective tape applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table is cut to a wafer configuration by a cutter unit. Subsequently, a protective tape having a weaker adhesion than the first protective tape is applied to the protective tape. The protective tapes forming plies are separated one by one, the upper one first, by a tape separating apparatus 15 after a thinning process of the wafer.
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