A circuit element includes a foam pad having a plurality of electrically conductive granules some of which are in electrical contact with each other and some of which are spaced apart from each other and an electrical path defined through the pad by the granules. The pad has a very high resistance which is a function of the geometry of the pad as well as the electrical path. The pad can be used to dissipate ESD as well as a resistor element. The pad is very versatile and can be used in a large number of situations and in conjunction with other circuit elements.