Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 5, 2008
Patent Application Number
10441879
Date Filed
May 20, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.
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