Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 5, 2008
Patent Application Number
10953454
Date Filed
September 30, 2004
Patent Primary Examiner
Patent abstract
There is provided a solution to the problem of the poor adhesion in the pad portion while inhibiting the dishing in the pad portion. An SiON film, which covers insulating areas and has an opening above Cu pad areas, is formed, and a barrier metal film is formed in the opening of the SiON film. Such constitution provides the structure, in which the upper portion of the interfaces between the Cu pad areas and the insulating areas are covered by the SiON film.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
