Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 5, 2008
Patent Application Number
11135967
Date Filed
May 24, 2005
Patent Primary Examiner
Patent abstract
In one embodiment, a photo-imageable material is deposited on a circuit structure. The photo-imageable material is then exposed to a pattern of radiation, thereby polymerizing portions of the photo-imageable. Un-polymerized portions of the photo-imageable material are then removed to define a solder mask having solder deposition areas. Solder is then deposited in the solder deposition areas. A circuit structure that may be produced in accordance with this method is also disclosed.
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