US Patent 7326629 Method of stacking thin substrates by transfer bonding
Patent 7326629 was granted and assigned to Agency for Science, Technology and Research on February, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 29, 2005
Date of Patent
February 5, 2008
Patent Application Number
11169907
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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