US Patent 7324716 Silicon packaging for opto-electronic modules

Patent 7324716 was granted and assigned to Intel on January, 2008 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

73247160

Patent Inventor Names

Marc Epitaux0

Date of Patent

January 29, 2008

Patent Application Number

110262590

Date Filed

December 30, 2004

Patent Primary Examiner

‌

Tina M Wong

Patent abstract

An opto-electronic apparatus comprising a base layer, one or more photonic elements positioned on the base layer, and an optical layer suspended over the base layer, the optical layer including a moveable optical element positioned over at least one of the photonic elements. A process comprising forming a base layer, placing one or more photonic elements on the base layer, and suspending an optical layer over the photonic elements on the base layer, the optical layer including a moveable optical element.