Patent attributes
A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained. The mold temperature adjusting apparatus comprises a high temperature fluid tank and a low temperature fluid tank, a high temperature fluid supply system and a high temperature fluid return system between the mold and the high temperature fluid tank, a low temperature fluid supply system and a low temperature fluid return system between the mold and the low temperature fluid tank, a high temperature fluid by-pass system and a low temperature fluid by-pass system, a heat recovery tank connected to the high temperature fluid tank and a pressure adjusting means.
