US Patent 7321160 Multi-part lead frame
Patent 7321160 was granted and assigned to Micron Technology on January, 2008 by the United States Patent and Trademark Office.
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Patent abstract
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
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US Patent 07321160 Multi-part lead frame US Patent 7321160 Multi-part lead frame
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Patent Number
0732116000
Patent Number
732116000
Edits on 25 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073211600
Date of Patent
January 22, 2008
0Patent Application Number
111370340
Date Filed
May 25, 2005
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073211600
Date of Patent
January 22, 2008
0Patent Application Number
111370340
Date Filed
May 25, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
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Edits on 23 Nov, 2021
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US Patent 07321160 Multi-part lead frame
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07321160
Date of patent
January 22, 2008
Patent application number
11137034
Date Filed
May 25, 2005
Patent primary examiner
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