A method in which a bore-hole is drilled through an insulating panel into a substructure, a dowel having cutting devices at the circumference of the lower side of the pressing plate and an expansion element are inserted into the bore-hole, and the expansion element is driven into the pressing plate and the dowel sleeve. The pressing plate is pulled into the insulating panel under compression of the insulating panel which is simultaneously cut at the circumference of the pressing plate. A method also drills through the insulating panel into the substructure, cuts a circle with at least the radius R into the insulating panel by cutting devices, with the dowel and the expansion element inserted into the bore-hole. The expansion element is driven into the pressing plate and the dowel sleeve, and simultaneously the pressing plate is pulled into the insulating panel under compression of the insulating panel.