US Patent 7312521 Semiconductor device with holding member

Patent 7312521 was granted and assigned to Sanyo on December, 2007 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Sanyo

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7312521

Date of Patent

December 25, 2007

Patent Application Number

10420943

Date Filed

April 23, 2003

Patent Primary Examiner

‌

Alexander Oscar Williams

Patent abstract

Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.