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US Patent 7312405 Module structure having embedded chips

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
November 14, 2005
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Date of Patent
December 25, 2007
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Patent Application Number
11273752
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Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11676832 Laser ablation system for package fabrication
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US Patent 11705365 Methods of micro-via formation for advanced packaging
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 11837680 Substrate structuring methods
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US Patent 11862546 Package core assembly and fabrication methods
0
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US Patent 11881447 Package core assembly and fabrication methods
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Patent Inventor Names
Shih-Ping Hsu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7312405
0
Patent Primary Examiner
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Jeremy C Norris
0

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