US Patent 7311009 Microelectromechanical systems contact stress sensor

Patent 7311009 was granted and assigned to Lawrence Livermore National Security (company) on December, 2007 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

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Lawrence Livermore National Security (company)

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7311009

Date of Patent

December 25, 2007

Patent Application Number

11143543

Date Filed

June 1, 2005

Patent Primary Examiner

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Edward Lefkowitz

Patent abstract

A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.