Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masayuki Yamamoto0
Takeshi Matsumura0
Date of Patent
December 18, 2007
0Patent Application Number
110129980
Date Filed
December 15, 2004
0Patent Primary Examiner
Patent abstract
A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.
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