Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideaki Kuwabara0
Toru Takayama0
Yumiko Ohno0
Yuugo Goto0
Etsuko Arakawa0
Junya Maruyama0
Shunpei Yamazaki0
Date of Patent
December 4, 2007
0Patent Application Number
107357670
Date Filed
December 16, 2003
0Patent Primary Examiner
Patent abstract
It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present invention, an integrated circuit film is mounted, thereby making a semiconductor device mounting the integrated circuit film thinner. The term “an integrated circuit film” means a film-like integrated circuit which is manufactured based on an integrated circuit manufactured by a semiconductor film formed over a substrate such as a glass substrate or a quartz substrate. In the present invention, the integrated circuit film is manufactured by a technique for transferring.
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