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US Patent 7300203 Non-contacting sensor multichip module with integral heat-sinks

Patent 7300203 was granted and assigned to Bourns, Inc. on November, 2007 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Bourns, Inc.
Bourns, Inc.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7300203
Patent Inventor Names
Jeffrey Tola1
Date of Patent
November 27, 2007
Patent Application Number
11244880
Date Filed
October 6, 2005
Patent Primary Examiner
‌
Gail Verbitsky
Patent abstract

A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and to the second portion. The second portion is pivotable about the hinge from an open position with respect to the first portion to a closed position with respect to the first portion. The assembly also includes a sensor positioned within the chamber and substantially encircled by the plurality of walls. The sensor is partially enclosed by the first portion and second portion when the second portion is in the closed position.

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