Patent attributes
A plurality of MEMS structures is formed on a wafer. The wafer is mounted on a dicing frame assembly having a dicing frame and a dicing tape attached to the dicing frame. A protective layer is applied to cover the entire surface of the wafer or may be limited to the portion of the surface of the wafer that includes the MEMS structures by any suitable means of coating techniques to protect the MEMS structures during dicing operation. The protective layer base material to be provided on the wafer may include linear carbon chain molecules containing 12-18 carbon atoms. The dicing operation is performed to divide the wafer into individual die. The protective layer is removed by any suitable process including decomposition, vaporized, sublimation or the like. For example, the protective layer may be evaporated through the application of heat after the die attachment process is completed. The heat application may be part of the cure cycle required for die bonding or may be a separate operation. Finally, the individual die are wire bonded and sealed to complete the packaging operation.
